bristol, pa 19007-6810 usa tel (215) 781-9956 ? fax (215) 781-9845 printouts of this document may be out of date and should be considered uncontrolled ? info@arieselec.com www.arieselec.com announcing significant improvements to our high-performance contact system. using our proven interposer elastomer technology, the new core feature internally controls compression to ensure stability with extremely low resistance values and much longer contact element life. (see interposer contact system life on following page). low interconnect parasitics make these sockets an ideal choice for device characterization or high-volume production testing of devices, such as power amplifiers, mixers, highly integrated rf ics, and microwave devices. insertion loss of -1db @ 40ghz return loss of -15db @ 22ghz interposer contact system with very short interconnects (available in 1.0mm or 0.6mm thickness) enhance adjacent channel power and noise sensitivity measurements. long-life hi-frequency sockets for bga, lga, qfn, mlcc, bga and bumped die devices interposer footprint lets the pcb designer locate impedance matching network components within 1mm of device pads. contact set interposer top side bottom side column array cross section tips pierce dut tails compress columns elastomer matrix compliant buttons ag particles 24005 rev. 1.2 1 of 2 ordering information this material can be ordered with any aries rf/csp sockets hand test automation qfn footprint ideally suited for rfic and microwave ic development & test interposer contact system C ar200 and ar300 series test sockets full-array shown as an example; your specific device pattern/footprint will be supplied when ordered.
bristol, pa 19007-6810 usa tel (215) 781-9956 ? fax (215) 781-9845 printouts of this document may be out of date and should be considered uncontrolled ? info@arieselec.com www.arieselec.com high-performance interposer contact technology suitable for manual & automated high-volume production test interposer contact system life: qfn 0.5mm pitch, 1.0mm full height ar200 series: 1.0mm full height ar300 series: 0.6mm half height specifications specifications (measured in a 0.5mm pitch environment, gsg) (estimated 0.5mm pitch environment, gsg) insertion loss s21 : -1db @ 40ghz insertion loss s21 : -1db @ >40ghz return loss s11 thru : -15db @ 22ghz return loss s11 thru : -15db @ >22ghz self inductance : 0.33nh self inductance : < 0.15nh mutual capacitance : < 0.05pf mutual capacitance : < 0.02pf operating temperature : -55c to 155c operating temperature : -55c to 155c contact resistance : < 25m contact resistance : < 25m current rating : 4a per lead with a 14c rise current rating : 4a per lead with a 14c rise contact length (compressed): 1.04mm contact length (compressed): 0.63mm contact force/travel : 25-45 gf/0.4mm travel contact force/travel : 25-45 gf/0.28mm travel contact set life : > 2,000,000 insertions contact set life : > 2,000,000 insertions interposer elastomer life : > 500,000 insertions interposer elastomer life : > 500,000 insertions interposer elastomer conductive columns, available in 2 standard heights with standard & custom pitches from 1.27mm to 0.4mm long-life hi-frequency sockets for bga, lga, qfn, mlcc, bga and bumped die devices 24005 rev. 1.2 2 of 2
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